MC54/74HC04A
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
-A-
14
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MIN
MAX
0.750 0.785
0.245 0.280
0.155 0.200
0.015 0.020
0.055 0.065
0.100 BSC
0.008 0.015
0.125 0.170
0.300 BSC
0°
15°
0.020 0.040
MILLIMETERS
MIN
MAX
19.05 19.94
7.11
6.23
5.08
3.94
0.50
0.39
1.65
1.40
2.54 BSC
0.38
0.21
4.31
3.18
7.62 BSC
15°
0°
0.51
1.01
-B-
1
7
C
L
-T-
SEATING
PLANE
K
F
G
D
14 PL
0.25 (0.010)
M
N
T A
S
M
J
14 PL
0.25 (0.010)
M
T
B
S
DIM
A
B
C
D
F
G
J
K
L
M
N
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0
_
10
_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0
_
10
_
0.39
1.01
B
1
7
A
F
C
N
H
G
D
SEATING
PLANE
L
J
K
M
High–Speed CMOS Logic Data
DL129 — Rev 6
5
MOTOROLA
MOTOROLA [ MOTOROLA, INC ]
