MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
ORDERING INFORMATION
Part Number
MP6231DN*
MP6231DH
MP6231DS
MP6232DN
MP6232DH
MP6232DS
Enable
Active
High
Dual
Active
Low
0.5A
750mA
Switch
Maximum
Typical Short-
Continuous Circuit Current
Load Current
@ T
A
=25C
Package
Top
Marking
Free Air
Temperature
(T
A
)
SOIC8E MP6231DN
MSOP8E
6231D
SOIC8
-40°C to +85°C
SOIC8E MP6232DN
MSOP8E
6232D
SOIC8
* For Tape & Reel, add suffix –Z (e.g. MP6231DN–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP6231DN–LF–Z)
PACKAGE REFERENCE
TOP VIEW
GND
IN
EN1*
EN2*
1
2
3
4
8
7
6
5
FLAG1
OUT1
OUT2
FLAG2
TOP VIEW
GND
IN
EN1*
EN2*
1
2
3
4
8
7
6
5
FLAG1
OUT1
OUT2
FLAG2
TOP VIEW
GND
IN
EN1*
EN2*
1
2
3
4
8
7
6
5
FLAG1
OUT1
OUT2
FLAG2
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
EXPOSED PAD
ON BACKSIDE
MSOP8E
SOIC8E
SOIC8
MP6231/MP6232Dual-Channel
(* EN is active high for MP6231)
ABSOLUTE MAXIMUM RATINGS
(1)
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
(2)
Continuous Power Dissipation (T
A
= +25°C)
SOIC8E...................................................... 2.5W
MSOP8E .................................................. 2.27W
SOIC8 ........................................................ 1.4W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature...............
-
65°C to +150°C
Operating Junct. Temp. ...........
-
40°C to +125°C
Thermal Resistance
(3)
SOIC8E .................................. 50 ...... 10...
°C/W
MSOP8E................................. 55 ...... 12...
°C/W
SOIC8..................................... 90 ...... 42...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/θ
JA
. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7， 4-layer PCB.
θ
JA
θ
JC
MP6231/MP6232 Rev. 1.2
3/31/2010
www.MonolithicPower.com
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2
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