MP6401 – 300mA LDO LINEAR REGULATOR WITH INTEGRATED RESET IC
PACKAGE REFERENCE
TOP VIEW
IN
IN
GND
EN
1
2
3
4
8
7
6
5
OUT
OUT
GND
2
3
5
4
ADJ
RESET
IN
1
TOP VIEW
6
OUT
TOP VIEW
EN
GND
IN
1
2
3
6
5
4
RESET
ADJ
OUT
ADJ
RESET
EN
TQFN8 (3mm x 3mm)
TQFN6 (2mm x 2mm)
TSOT23-6
(4)
ABSOLUTE MAXIMUM RATINGS
(1)
IN, EN, OUT.................................–0.3V to + 6 V
ADJ ..................................................–0.3V to 6V
RESET .............................................–0.3V to 6V
(2)
Continuous Power Dissipation. (T
A
= +25°C)
TQFN8 (3mm x 3mm) .............................. 2.6W
TQFN6 (2mm x 2mm) ............................ 1.56W
TSOT ....................................................... 0.57W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature.............. –65°C to +150°C
Thermal Resistance
TQFN8 (3mm x 3mm) ...........48 ...... 11 ...
°C/W
TQFN6 (2mm x 2mm) ...........80 ...... 16 ...
°C/W
TSOT .....................................220 .... 110 ..
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
(MAX),
the
maximum
junction
temperature
T
J
junction-to-ambient thermal resistance
θ
JA
, and the ambient
temperature T
A
. The maximum allowable continuous power
dissipation at any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/θ
JA
. Exceeding the maximum allowable
power dissipation will cause excessive die temperature, and
the regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
o
damage. Thermal shutdown engages at T
J
=150 C(TYP) and
o
disengages at T
J
=130 C(TYP)
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer board.
θ
JA
θ
JC
Recommended Operating Conditions
(3)
Supply Voltage V
IN
..........................2.5V to 5.5V
Operating Junct. Temp (T
J
)..... –40°C to +125°C
MP6401 Rev. 1.0
9/7/2012
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