PS2561-1,-2,PS2561L-1,-2
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of temperature higher than 210 °C
• Number of reflows
• Flux
235 °C (package surface temperature)
30 seconds or less
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (˚C)
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
120 to 160 ˚C
60 to 90 s
(preheating)
Time (s)
Caution
Please avoid to removed the residual flux by water after the first reflow processes.
Peak temperature 235 ˚C or below
(2) Dip soldering
• Temperature
• Time
• Number of times
• Flux
260 °C or below (molten solder temperature)
10 seconds or less
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
10
NEC [ NEC ]
