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PG2009TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
WS260
VP215
Condition Symbol
IR260
For soldering
Preheating temperature (package surface temperature) : 120°C or below
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet PG10191EJ02V0DS
NEC [ NEC ]
