HMC110
MICROWAVE CORPORATION
HMC110
5 - BIT DIGITAL ATTENUATOR DC - 10 GHz
F
EBRUARY
2001
Die Outline
( See page 8 - 2
0.178 (0.007)
0.102 (0.004)
and 8 - 3 DIE HANDLING NOTES)
1.676 (0.066)
0.127 (0.005)
9 equal spaces @ 0.152 (0.006) each
2
0.864 (0.034)
0.102 (0.004)
0.076 (0.003)
ALL DIMENSIONS IN MILLIMETERS (INCHES)
ALL TOLERANCES ARE ±0.025 (0.001)
DIE THICKNESS IS 0.203 (0.008), BACKSIDE IS NOT METALLIZED
BOND PADS ARE 0.100 (0.004) SQUARE
ALL UNLABELED BOND PADS ARE GROUND.
BOND PAD METALLIZATION: GOLD
BACKSIDE METALLIZATION : NONE
Suggested Driver Circuit
Vz=5.1V
Izt=50uA
COMPENSATED
DEVICES
CD4689
TTL
OR
CMOS
VCC
GND
VCC
GND
74HCT04 (TTL)
74HC04 (CMOS)
100Ω
*
100pF
*
100Ω
*
A
GaAs
ATTENUATOR
CONTROL
10K
B
100pF
*
-5 VDC
Simple driver using inexpensive standard logic ICs provides fast switching using minimum DC current.
* Recommended values to suppress unwanted RF signals at A/B control lines. You may adjust for switching
speed considerations.
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
2-5
DIE
A
TTENUATORS
0.279 (0.011)
A1
RF1
B1
A2
A3 A4
4306
B4
A5
B5
A6
B6
RF2
NEL [ NEL FREQUENCY CONTROLS,INC ]
