SEMICONDUCTOR
RoHS
8T Series
RoHS
Fig.9 Relative variation of critical rate of decrease
of main current versus junction temperature.
Fig.10 DPAK and D
2
PAK Thermal resistance junction
to ambient versus copper surface under tab
(printed circuit board Fr4, copper thickness:
35 µm.)
(dI/dt)c [T
j
] / (dI/dt)c [T
j
specified]
6
5
4
3
2
1
T
j
(°C)
Rth(j-a)
(°C/W)
100
90
80
70
60
50
40
30
20
10
75
100
125
0
0
4
8
12
16
S(cm
2
)
D
2
PAK
DPAK
0
0
25
50
20
24
28
32
36
40
Case Style
TO-220AB
10.54 (0.415)
MAX.
9.40 (0.370)
9.14 (0.360)
3.91 (0.154)
3.74 (0.148)
2.87 (0.113)
2.62 (0.103)
3.68 (0.145)
3.43 (0.135)
16.13 (0.635)
15.87 (0.625)
3
15.32 (0.603)
14.55 (0.573)
8.89 (0.350)
8.38 (0.330)
29.16 (1.148)
28.40 (1.118)
2.79 (0.110)
2.54 (0.100)
14.22 (0.560)
13.46 (0.530)
0.90 (0.035)
0.70 (0.028)
5.20 (0.205)
4.95 (0.195)
0.56 (0.022)
0.36 (0.014)
4.70 (0.185)
4.44 (0.1754)
1.39 (0.055)
1.14 (0.045)
1
4.06 (0.160)
3.56 (0.140)
1.45 (0.057)
1.14 (0.045)
2.67 (0.105)
2.41 (0.095)
2.65 (0.104)
2.45 (0.096)
PIN
2
TO-263(D
2
PAK)
10.45 (0.411)
9.65 (0.380)
6.22 (0.245)
4.83 (0.190)
4.06 (0.160)
1.40 (0.055)
1.14 (0.045)
9.14 (0.360)
8.13 (0.320)
1.40 (0.055)
1.19 (0.047)
15.85 (0.624)
15.00 (0.591)
0
to
0.254 (0
to
0.01)
2.79 (0.110)
2.29 (0.090)
0.53 (0.021)
0.36 (0.014)
3.56 (0.140)
5.20 (0.205)
4.95 (0.195)
2.79 (0.110)
0.940 (0.037)
0.686 (0.027)
2.67 (0.105)
2.41 (0.095)
www.nellsemi.com
Page 6 of 7
NELLSEMI [ NELL SEMICONDUCTOR CO., LTD ]
