NICHIA STS-DA1-1762H <Cat.No.131031>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
260°CMax
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
● Recommended Soldering Pad Pattern
8.6
4
3.4
(単位 Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Repairing should not be done after the LEDs have been soldered.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* The Die Heat Sink should be soldered to customer PCB.
If it is difficult or impossible, use high heat-dissipating adhesive.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product.
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
4
NICHIA [ NICHIA CORPORATION ]
