Nichia STSE-CC5172B
<Cat.No.070427>
(4) Designing the position of LED on a board.
· No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder
to avoid a crack of LED package.
Refer to the following recommended position and direction of LED.
【No
good】
【Recommended
Direction】
Cathode mark
Cathode mark
Appropriate LED mounting is to place perpendicularly against the stress affected side.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
Ｅ
Perforated line
Ａ
Ｃ
Ｄ
Ｂ
Slit
Stress : A > B = C > D > E
· Do not split board by hand. Split with exclusive special tool.
· If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack.
For this reason, it is recommended an appropriate verification should be taken before use.
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NICHIA [ NICHIA CORPORATION ]
