Nichia STS-DA1-0037
<Cat.No.071122>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
JEITA ED-4701
400 403
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C,
(Lead Solder)
3sec.
Note
2 times
Number of
Damaged
0/22
1 time
over 95%
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
1000 hrs.
48min.
0/22
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/10
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C, I
F
=120mA
Tested with Nichia standard circuit board.
Ta=85°C, I
F
=110mA
Tested with Nichia standard circuit board.
60°C, RH=90%, I
F
=120mA
Tested with Nichia standard circuit board.
Ta=-30°C, I
F
=60mA
Tested with Nichia standard circuit board.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3directions, 4cycles
Thermal resistance of LED with Nichia standard circuit board : Rja
≒
110°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Item
Symbol Test Conditions
Forward Voltage
V
F
I
F
=60mA
-
Initial Level
Luminous Flux
φv
I
F
=60mA
Initial Level 0.7
-
The test is performed after the board is cooled down to the room temperature.
Criteria for Judgement
Min.
Max.
1.1
-4-
NICHIA [ NICHIA CORPORATION ]
