Nichia STSE-CC7083A
<Cat.No.070608>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Condition 1
Steady State Operating Life
Condition 2
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C,
3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
Ta=60°C,
Ta=-40°C
Ta=25°C, I
F
=20mA
Ta=25°C, I
F
=30mA
Ta=85°C, I
F
=8.5mA
60°C, RH=90%, I
F
=15mA
Ta=-30°C, I
F
=20mA
JEITA ED-4701
400 403
JEITA ED-4702
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3directions, 4cycles
3mm, 5 ± 1 sec.
RH=90%
Note
2 times
Number of
Damaged
0/50
1 time
over 95%
20 cycles
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
1000 hrs.
500 hrs.
1000 hrs.
48min.
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
Substrate Bending
1 time
0/50
(2) CRITERIA FOR JUDGING DAMAGE
Item
Symbol Test Conditions
Forward Voltage
V
F
I
F
=20mA
-
U.S.L.*)
Reverse Current
I
R
V
R
=5V
-
U.S.L.*)
Luminous Intensity
I
V
I
F
=20mA
L.S.L.**) 0.7
-
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
-3-
Criteria for Judgement
Min.
Max.
1.1
2.0
NICHIA [ NICHIA CORPORATION ]
