SBD
Type
:
EC10QS09
OUTLINE DRAWING
FEATURES
* Miniature Size,Surface Mount Device
* Low Forward Voltage Drop
* Low Power Loss,High Efficiency
* High Surge Capability
* 30 Volts through 100Volts Types Available
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Approx Net Weight:0.06g
Symbol
V
RRM
I
O
I
F(RMS)
I
FSM
T
jw
T
stg
20
0.92
1.0
EC10QS09
90
Ta=25
°C
*1
Ta=55
°C
*2
50Hz Half Sine
Wave Resistive Load
Unit
V
A
A
A
°C
°C
1.57
50Hz Half Sine Wave,1cycle
Non-repetitive
-40 to +150
-40 to +150
Electrical
•
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Thermal Resistance
Symbol
I
RM
V
FM
Conditions
Tj= 25°C, V
RM
= V
RRM
Tj= 25°C, I
FM
= 1.0A
*1
*2
Min.
-
-
-
-
Typ.
-
-
-
-
Max.
0.5
0.85
157
108
Unit
mA
V
°C
/W
Rth
(j-a)
Junction to Ambient
*1 Glass Epoxy Substrate Mounted
*2 Alumina Substrate Mounted
Soldering Lands=2x2mm,Both Sides
NIEC [ NIHON INTER ELECTRONICS CORPORATION ]
