FRD
Type
:
EC11FS4
OUTLINE DRAWING
FEATURES
* Miniature Size,Surface Mount Device
* Ultra-Fast Recovery
* Low Forward Voltage Drop
* Low Power Loss, High Efficiency
* High Surge Capability
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Non-repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Approx Net Weight:0.06g
Symbol
V
RRM
V
RSM
I
O
I
F(RMS)
I
FSM
T
jw
T
stg
20
0.76
1.0
EC11FS4
400
440
Ta=25°C *1
Ta=26°C *2
50Hz Half Sine
Wave Resistive Load
Unit
V
V
A
A
A
°C
°C
1.57
50Hz Half Sine Wave,1cycle
Non-repetitive
-40 to +150
-40 to +150
Electrical
•
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery Time
Symbol
I
RM
V
FM
trr
Conditions
Min.
-
-
-
-
-
Typ.
-
-
-
-
-
Max.
20
1.25
30
157
108
Unit
µA
V
ns
°C
/W
Tj= 25°C, V
RM
= V
RRM
Tj= 25°C, I
FM
= 1.0A
I
FM
= 1A, -di/dt= 50A/µs, Ta= 25°C
*1
Thermal Resistance
Rth
(j-a)
Junction to Ambient
*2
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
NIEC [ NIHON INTER ELECTRONICS CORPORATION ]
