OUTLINE DRAWING
DIODE
FEATURES
*
*
*
*
*
*
Type
:
NSD03A40
FLAT-PAK
Surface Mount Device
High Surge Capability
Low Forward Voltage Drop
Low Reverse Leakage Current
Packaged in 16mm Tape and Reel
Not Rolling During Assembly
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Approx Net Weight:016g
Symbol
V
RRM
I
O
I
F(RMS)
I
FSM
T
jw
T
stg
80
1.57
3.0
NSD03A40
400
50Hz Half Sine
Ta=25
°C
*1
Wave Resistive Load
T1=108
°C
*2
4.71
50Hz Half Sine Wave,1cycle
Non-repetitive
-40 to +150
-40 to +150
Unit
V
A
A
A
°C
°C
Electrical
•
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Symbol
Conditions
Min.
-
-
-
-
Typ.
-
-
-
-
Max.
50
1.0
89
13
Unit
µA
V
°C
/W
I
RM
Tj= 25°C, V
RM
= V
RRM
V
FM
Tj= 25°C, I
FM
= 3.0A
Rth
(j-a)
Junction to Ambient *1
Thermal Resistance
Rth
(j-l)
Junction to Lead
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Tl= Lead Temperature
NIEC [ NIHON INTER ELECTRONICS CORPORATION ]
