OUTLINE DRAWING
FRD
*
*
*
*
*
*
*
Type
:
NSF03A20
FEATURES
FLAT-PAK
Surface Mount Device
Ultra Fsat Recovery
High Surge Capability
Low Forward Voltage Drop
Low Power Loss, High Efficiency
Packaged in 16mm Tape and Reel
Not Rolling During Assembly
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Approx Net Weight:016g
Symbol
V
RRM
I
O
I
F(RMS)
I
FSM
T
jw
T
stg
45
1.61
3.0
NSF03A20
200
50Hz Half Sine
Ta=25
°C
*1
Wave Resistive Load
T1=106
°C
*2
4.71
50Hz Half Sine Wave,1cycle
Non-repetitive
-40 to +150
-40 to +150
Unit
V
A
A
A
°C
°C
Electrical
•
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery Time
Symbol
Conditions
Min.
-
-
-
-
Typ.
-
-
-
-
Max.
10
0.98
30
89
13
Unit
µA
V
ns
°C
/W
I
RM
Tj= 25°C, V
RM
= V
RRM
V
FM
Tj= 25°C, I
FM
= 3.0A
trr
Ta= 25°C, I
FM
=3.0 A –di/dt=50A/µs
Rth
(j-a)
Junction to Ambient *1
Thermal Resistance
Rth
(j-l)
Junction to Lead
*1 Alumina Substrate Mounted (Soldering Lands=2x3.5mm,Both Sides)
*2 Tl= Lead Temperature
NIEC [ NIHON INTER ELECTRONICS CORPORATION ]
