SM8133B
SPECIFICATIONS
Absolute Maximum Ratings
GND = PGND = 0V
Note. The device may suffer breakdown if any one of these parameter ratings is exceeded.
Parameter
Supply voltage range
Input voltage range
Output voltage range
VOUT output current
LDO output current
Power dissipation
Junction temperature
Storage temperature range
Symbol
V
IN
V
EN
, V
SEL
V
DIN1 to 7
V
OUT
I
OUT
I
LDO
P
D
T
JMAX
T
stg
Rating
−
0.3 to 5.5
–0.3 to V
IN
+ 0.3
–0.3 to V
IN
+ 0.3
5.5
500
200
1429 (Ta = 25
°
C)
*1
+125
−
55 to +125
Unit
V
V
V
V
mA
mA
mW
°
C
°
C
*1. When mounted on a 34
×
40
×
1.6mm glass epoxy board, the power dissipation is related to the operating temperature
by the following equation.
I
I
I
Maximum junction temperature: T
MAX
= 125
°
C
Operating temperature: Ta [
°
C]
Thermal resistance:
θ
J
= 70
°
C/W
Power dissipation [mW]
1600
1429
1200
1143
857
800
571
P
D
=
(T
MAX
−
Ta)
θ
J
400
0
25
35
45
55
65
75
85
Operating temperature [°C]
Recommended Operating Conditions
GND = PGND = 0V
Rating
Parameter
Pin
Symbol
V
IN1
Supply voltage range
VIN
V
IN2
V
IN3
Input voltage range
Ambient temperature range
EN, SCK,
SDA,
RESETB
−
V
ES
Ta
Conditions
min
×
1.0 mode, I
OUT
= 0mA
×
1.5 mode, I
OUT
= 80mA
×
1.5 mode, I
OUT
= 200mA
Each logic-level pin
2.7
3.0
3.3
0
−30
typ
3.6
3.6
3.6
−
−
max
4.6
4.6
4.6
V
IN
+85
V
V
V
V
°C
Unit
NIPPON PRECISION CIRCUITS INC.—5
NPC [ NIPPON PRECISION CIRCUITS INC ]
