SM8140A
PAD DIMENSIONS
PAD COORDINATES
( UNIT:µm )
No.
1
NAME
OCE2
OCE1
ENA
X
Y
360
190
2
900
190
(2500, 2700)
1312 11 10 9
3
1440
2080
2310
2310
2310
2310
2300
2100
1900
1700
1500
190
190
4
VSS2
VDD
190
5
320
6
CPO
560
8
7
14
15
7
CP1
1100
1640
2530
2530
2530
2530
2530
1600
1040
500
8
CP2
9
OUT2
OUT1
CHV
MONG
LDR
6
5
10
11
12
13
14
15
16
16
Y
(0, 0)
1
2
3
4
X
VSS1
OCL2
OCL1
190
190
Chip size : 2.50 × 2.70mm
Chip thickness : 4000 ± 30µm
Pad size : 100 × 100µm
Note : MONG is test pin.
MONG and VSS2 are not bonding.
Chip reverse side : V
SS
NIPPON PRECISION CIRCUITS—2
NPC [ NIPPON PRECISION CIRCUITS INC ]
