5075 series
SERIES CONFIGURATION
Operating
supply voltage
range [V]
PAD layout
Recommended
operating frequency
range
*1
[MHz]
20 to 40
Flip Chip Bonding
40 to 55
2.25 to 3.63
20 to 40
Wire Bonding
40 to 55
5075BJ
(5075BK)
(5075BL)
(5075BM)
(5075BN)
*1. The recommended operating frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscil-
lation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so
the oscillation characteristics of components must be carefully evaluated.
*2. Versions in parentheses ( ) are under development.
5075B1
(5075B2)
(5075B3)
(5075B4)
(5075B5)
(5075AJ)
(5075AK)
(5075AL)
(5075AM)
(5075AN)
Output frequency and version name
*2
f
O
output
(5075A1)
f
O
/2 output
(5075A2)
f
O
/4 output
(5075A3)
f
O
/8 output
(5075A4)
f
O
/16 output
(5075A5)
VERSION NAME
Device
WF5075
××
–4
Package
Wafer form
Version name
WF5075
Form WF: Wafer form
CF: Chip (Die) form
−4
Oscillation frequency range, frequency divider function
Pad layout type A: for Flip Chip Bonding
B: for Wire Bonding
CF5075××–4
Chip form
SEIKO NPC CORPORATION —2
NPC [ NIPPON PRECISION CIRCUITS INC ]
