DC Electrical Characteristics
Symbol
I
CCH
I
CCL
I
CCZ
I
CCH
I
CCL
I
CCZ
Parameter
(Continued)
54F 74F
Min
Typ
19
50
42
40
60
60
Max
29
75
63
60
90
90
mA
mA
mA
mA
mA
mA
Max
Max
Max
Max
Max
Max
V
O
e
HIGH
V
O
e
LOW
V
O
e
HIGH Z
V
O
e
HIGH
V
O
e
LOW
V
O
e
HIGH Z
Units
V
CC
Conditions
Power Supply Current (’F240)
Power Supply Current (’F240)
Power Supply Current (’F240)
Power Supply Current
(’F241 ’F244)
Power Supply Current
(’F241 ’F244)
Power Supply Current
(’F241 ’F244)
AC Electrical Characteristics
74F
Symbol
Parameter
Min
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
Propagation Delay
Data to Output (’F240)
Output Enable Time (’F240)
Output Disable Time (’F240)
Propagation Delay
Data to Output (’F241 ’F244)
Output Enable Time
(’F241 ’F244)
Output Disable Time
(’F241 ’F244)
30
20
20
40
20
20
25
25
20
20
20
20
T
A
e a
25 C
V
CC
e a
5 0V
C
L
e
50 pF
Typ
51
35
35
69
40
60
40
40
43
54
45
45
Max
70
47
47
90
53
80
52
52
57
70
60
60
54F
T
A
V
CC
e
Mil
C
L
e
50 pF
Min
30
20
20
40
20
20
20
20
20
20
20
20
Max
90
60
65
10 5
65
12 5
65
70
70
85
70
75
74F
T
A
V
CC
e
Com
C
L
e
50 pF
Min
30
20
20
40
20
20
25
25
20
20
20
20
Max
80
57
57
10 0
63
95
62
65
67
80
70
70
ns
ns
Units
ns
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
Temperature Range Family
74F
e
Commercia
54F
e
Military
Device Type
Package Code
P
e
Plastic DIP
D
e
Ceramic DIP
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC JEDEC
MSA
e
Shrink Small Outline Package (EIAJ SSOP)
(’244 only)
SJ
e
Small Outline SOIC EIAJ
240 241 244
S
C
X
Special Variations
QB
e
Military grade device with
environmental and burn-in
processing
X
e
devices shipped in 13 reel
Temperature Range
C
e
Commercial (0 C to
a
70 C)
M
e
Military (
b
55 C to
a
125 C)
NOTE
Not required for MSA package
code
5
NSC [ NATIONAL SEMICONDUCTOR ]
