M25P20
Revision history
Table 24. Document revision history (continued)
Date
Revision
Changes
50MHz operation added (see Table 20: AC Characteristics (50MHz
Operation, Device Grade 6)). All packages are ECOPACK®. Blank option
removed from under Plating Technology in Table 23: Ordering Information
Scheme. MLP package renamed as VFQFPN, silhouette and package
mechanical drawing updated (see package silhouette on page 1 and
Figure 27: VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Quad Flat
Package No lead, 6x5mm, Package Outline. Note added to <Blue>Figure
26. and Figure 27 Read Identification (RDID) instruction added.
01-Dec-2005
7.0
tRES1 and tRES2 modified in Table 20: AC Characteristics (50MHz
Operation, Device Grade 6). Titles of Figure 27 and Table 22 corrected.
22-Dec-2005
8.0
The data contained in Table 11, Table 16 and Table 18 is no longer
preliminary data.
Figure 3: Bus Master and memory devices on the SPI Bus modified and
Note 2 added.
40MHz frequency condition modified for ICC3 in Table 14: DC
Characteristics (Device Grade 3).
Table 16: Instruction Times (Device Grade 3) shows preliminary data.
14-Apr-2006
9
Device Grade distinction removed, Condition changed for the Data
Retention parameter in Table 11: Data Retention and Endurance.
VWI parameter for Device Grade 3 added to Table 8: Power-Up Timing
and VWI Threshold.
SO8 package specifications updated (see Figure 26 and Table 21).
/X Process added to Table 23: Ordering Information Scheme.
tRES1 and tRES2 parameter timings changed for devices produced with the
“X” process technology in Table 18 and Table 19.
05-Jun-2006
10-Dec-2007
10
11
SO8 Narrow package specifications updated (see Figure 26 and
Table 21).
Applied Numonyx branding.
49/50
NUMONYX [ NUMONYX B.V ]
