Revision history
M25P80
13
Revision history
Table 21.
Date
Document revision history
Revision
Changes
Document released as a Product Preview data sheet
Clarification of descriptions of entering Standby Power mode from Deep
Power-down mode, and of terminating an instruction sequence or data-out
sequence.
VFQFPN8 package (MLP8) added. Order code (MW) corrected on page 1
for SO8 package. Document promoted to Preliminary Data.
Typical Page Program time improved. Write Protect setup and hold times
specified, for applications that switch Write Protect to exit the Hardware
Protection mode immediately before a WRSR, and to enter the Hardware
Protection mode again immediately after.
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
40MHz AC Characteristics table included as well as 25MHz. Change of
naming for VDFPN8 package. Document promoted to full datasheet
Improvement to description of reading the 8-bit electronic signature.
SO16 package added. SO8W package removed. Soldering temperature
information clarified for RoHS compliant devices. Device Grade clarified
Automotive range added
SO8W package re-instated, but under limited availability
Data-retention measurement temperature corrected. Details of how to find
the date of marking added.
Updated Page Program (PP) instructions in
and
Instruction Times (Device Grade 3).
SO16 package removed. All packages are ECOPACK®. MLP8 package
renamed as VFQFPN8. Plating technology clarified in
VFQFPN silhouette modified (see silhouette
t
SHQZ
timing modified in
Device grade 3 specifications removed from datasheet. Data retention
conditions changed in
modified and
Note 2
added.
Note 2
added below
and
Note 2
added below
Note on SO8 package removed below
SO8N package added (see
and
24-Apr-2002
1.0
27-Sep-2002
1.1
13-Dec-2002
1.2
24-Oct-2003
2.0
24-Nov-2003
21-Apr-2004
07-May-2004
18-May-2004
05-Aug-2004
01-Aug-2005
2.1
3.0
4.0
5.0
6.0
7.0
20-Oct-2005
8.0
13-Apr-2006
9
20-Jul-2006
10
50/52