Numonyx™ Embedded Flash Memory (J3 v. D)
Table 1:
56-Lead TSOP Dimension Table
Millimeters
Inches
Max
Min
Nom
56
5°
0.100
0.150
0.250
0.350
0.006
0.010
0°
3°
5°
0.004
0.014
Max
Symbol
Min
Nom
56
0°
3°
N
q
Y
Z
Parameter
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
3.2
Figure 5:
Easy BGA Package (32, 64, 128 and 256 Mbit)
Easy BGA Mechanical Specifications
Ball A1
Corner
D
S
1
Ball A1
Corner
1
A
B
C
D
E
F
G
H
2
3
4
5
6
7
8
A
B
C
E
D
E
F
G
H
8
7
6
5
4
3
2
1
S
2
e
b
Top View - Plastic Backside
Complete Ink Mark Not Shown
A1
A2
A
Bottom View - Ball Side Up
Seating
Plane
Y
Table 2:
Easy BGA Package Dimensions Table (Sheet 1 of 2)
Millimeters
Parameter
Symb
ol
A
A
A1
A2
0.250
0.780
Min
Nom
Max
1.200
1.300
0.0098
0.0307
Note
s
Min
Inches
Nom
Max
0.0472
0.0512
Package Height (32, 64, 128- Mbit)
Package Height (256- Mbit)
Ball Height
Package Body Thickness (32, 64, 128- Mbit)
November 2007
308551-05
Datasheet
13
NUMONYX [ NUMONYX B.V ]
