E2Q0032-38-72
¡ electronic components
This version: Jul. 1998
Previous version: Jan. 1998
KGF1323F
¡
electronic components
KGF1323F
Power FET (Plastic Package Type)
GENERAL DESCRIPTION
The KGF1323F, housed in a SOT-89 type plastic-mold package, is a KGF1323-based discrete
GaAs power FET that features high efficiency and high output power. The KGF1323F
specifications are guaranteed to a fixed matching circuit for 5.8 V and 850 MHz; external
impedance-matching circuits are also required. Specified specifically for analog cellular appli-
cations, the KGF1323F is ideally suited to applications requiring a transmitter-final-stage
amplifier for a cellular phone, such as AMPS and TACS. The device is directly mounted to a
printed circuit board.
FEATURES
• Specifications guaranteed to a fixed matching circuit for 5.8 V and 850 MHz
• High output power: 31.5 dBm (min.)
• High efficiency: 70% (typ.)
• Low thermal resistance: 14°C/W (typ.)
• Package: 3PMMP (SOT-89 type)
PACKAGE DIMENSIONS
4.5
±
0.1
1.6
+0.15
–0.10
1.5
±
0.1
2.5
±
0.1
1
±
0.2
4
±
0.2
0.48
+0.08
–0.05
0.4
+0.08
–0.05
1.5
±
0.1 1.5
±
0.1
3
±
0.1
0.4
+0.08
–0.05
0.39
±
0.05
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
Cu
Solder plating
5
mm
or more
(Unit: mm)
1/6
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