FEDW9042BB-02
Semiconductor
MBF9042BB
RECOMMENDATION FOR SOLDER PAD PATTERN
The solder pad pattern should be designed by customers because it depends on the electrical performance of the
customers’ system. Following is an example of solder pad pattern which is used in OKI’s package evaluation
board. Please be noted that this is for reference purpose only
.
25
µm
0.1 mm
0.1 mm
25
µm
0.5 mm
0.1 mm
PCB pad pattern
Metal mask pattern
Pad of Device
Please pay attention to the following items to maintain electrical performance.
(1) Metal mask pattern for cream solder should be 25
µm
smaller on each side. Metal mask is 0.15 mm in
thickness.
(2) As the impedance of Tx, Rx, ANT is designed for 50
Ω,
please consider this for the design of mother board.
(3) The performance of these devices is assured when GND pad (Pin 17) is connected. GND pad (Pin 17) should
be soldered in the same way as above.
9/11
OKI [ OKI ELECTRONIC COMPONETS ]
