2N3906
General Purpose
Transistors
PNP Silicon
Features
http://onsemi.com
COLLECTOR
3
2
BASE
Symbol
V
CEO
V
CBO
V
EBO
I
C
P
D
P
D
P
D
T
J
, T
stg
Value
40
40
5.0
200
625
5.0
250
1.5
12
−55
to +150
Unit
Vdc
Vdc
Vdc
mAdc
mW
mW/°C
mW
W
mW/°C
°C
TO−92
CASE 29
STYLE 1
12
1
2
1
EMITTER
•
Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Collector
−
Emitter Voltage
Collector
−
Base Voltage
Emitter
−
Base Voltage
Collector Current
−
Continuous
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 60°C
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
3
STRAIGHT LEAD
BULK PACK
3
BENT LEAD
TAPE & REEL
AMMO PACK
THERMAL CHARACTERISTICS
(Note 1)
Characteristic
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Symbol
R
qJA
R
qJC
Max
200
83.3
Unit
°C/W
°C/W
2N
3906
ALYWG
G
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates Data in addition to JEDEC Requirements.
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2010
February, 2010
−
Rev. 4
1
Publication Order Number:
2N3906/D