AMIS-30622
3.
Pin-out
1
2
3
4
5
6
7
8
9
10
SDA
SCK
VDD
GND
TST1
TST2
GND
HW
CPN
CPP
SWI
VBB
MOTXP
GND
MOTXN
MOTYP
GND
MOTYN
VBB
VCP
20
19
18
17
16
15
14
13
12
11
SOIC-20
Pin name
SDA
SCK
VDD
GND
TST1
TST2
HW
CPN
CPP
VCP
VBB
MOTYN
MOTYP
MOTXN
MOTXP
SWI
Pin description
Serial I/O
Clock for SDA
Internal supply (needs external decoupling capacitor)
Ground, heat sink
test pin (to be tied to ground in normal operation)
test pin (to be left open in normal operation)
Hardwired address bit
Negative connection of pump-capacitor (charge pump)
Positive connection of pump-capacitor (charge pump)
Charge-pump filter-capacitor
Battery voltage supply
Negative end of phase Y coil
Positive end of phase Y coil
Negative end of phase X coil
Positive end of phase X coil
Switch input
SOIC-20
1
2
3
4,7,14,17
5
6
8
9
10
11
12, 19
13
15
16
18
20
4.
4.1.
Package thermal resistance
SO20
2
×
(10mm
×
23mm)
The junction-case thermal resistance is 28°
C/W,
leading to a junction-ambient thermal resistance of
63°C/W, with the PCB ground plane layout condition
given on the figure beside, and with:
•
•
•
PCB thickness = 1.6mm
1 layer
Copper thickness = 35µm
Rev. 3 | Page 7 of 42 | www.onsemi.com
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