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MC10E131FN 参数 Datasheet PDF下载

MC10E131FN图片预览
型号: MC10E131FN
PDF下载: 下载PDF文件 查看货源
内容描述: 5V ECL 4位D触发器 [5V ECL 4-Bit D Flip-Flop]
分类和应用: 触发器逻辑集成电路输入元件
文件页数/大小: 8 页 / 130 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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MC10E131, MC100E131
5V ECL 4-Bit D Flip-Flop
Description
The MC10E/100E131 is a quad master-slave D-type flip-flop with
differential outputs. Each flip-flop may be clocked separately by
holding Common Clock (C
C
) LOW and using the Clock Enable (CE)
inputs for clocking. Common clocking is achieved by holding the CE
inputs LOW and using C
C
to clock all four flip-flops. In this case, the
CE inputs perform the function of controlling the common clock, to
each flip-flop.
Individual asynchronous resets are provided (R). Asynchronous set
controls (S) are ganged together in pairs, with the pairing chosen to
reflect physical chip symmetry.
Data enters the master when both C
C
and CE are LOW, and transfers
to the slave when either C
C
or CE (or both) go HIGH.
The 100 Series contains temperature compensation.
Features
http://onsemi.com
PLCC−28
FN SUFFIX
CASE 776
1100 MHz Min. Toggle Frequency
Differential Outputs
Individual and Common Clocks
Individual Resets (asynchronous)
Paired Sets (asynchronous)
PECL Mode Operating Range: V
CC
= 4.2 V to 5.7 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
=
−4.2
V to
−5.7
V
Metastability Time Constant is 200 ps.
Internal Input 50 kW Pulldown Resistors
ESD Protection: Human Body Model; > 2 kV,
Machine Model; > 200 V
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level:
Pb = 1
Pb−Free = 3
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 240 devices
Pb−Free Packages are Available*
MARKING DIAGRAM*
1
MCxxxE131G
AWLYYWW
xxx
A
WL
YY
WW
G
= 10 or 100
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
November, 2006
Rev. 11
1
Publication Order Number:
MC10E131/D