MC34063A MC33063A
OUTLINE DIMENSIONS
P, P1 SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
8
5
–B–
1
4
F
NOTE 2
–A–
L
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
9.40 10.16
6.60
6.10
4.45
3.94
0.51
0.38
1.78
1.02
2.54 BSC
1.27
0.76
0.30
0.20
3.43
2.92
7.62 BSC
—
10°
1.01
0.76
INCHES
MIN
MAX
0.370 0.400
0.240 0.260
0.155 0.175
0.015 0.020
0.040 0.070
0.100 BSC
0.030 0.050
0.008 0.012
0.115 0.135
0.300 BSC
—
10°
0.030 0.040
C
–T–
SEATING
PLANE
J
N
D
H
G
0.13 (0.005)
M
K
T
A
M
M
B
M
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE P
–A–
8
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.18
0.25
0.10
0.25
0
_
7
_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.189
0.196
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.007
0.009
0.004
0.009
0
_
7
_
0.229
0.244
0.010
0.019
–B–
1
4
4X
P
0.25 (0.010)
M
B
M
C
–T–
8X
SEATING
PLANE
R
X 45
_
F
D
0.25 (0.010)
M
K
T B
M
_
S
J
S
A
10
MOTOROLA ANALOG IC DEVICE DATA
ONSEMI [ ON SEMICONDUCTOR ]
