SS26
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal−to−silicon
power rectifier. Features epitaxial construction with oxide passivation
and metal overlay contact. Ideally suited for low voltage, high
frequency switching power supplies; free wheeling diodes and
polarity protection diodes.
Features
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Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Overvoltage Protection
Low Forward Voltage Drop
Pb−Free Package is Available
Case: Molded Epoxy
Epoxy Meets UL 94, V−O at 0.125 in
Weight: 95 mg (approximately)
Cathode Polarity Band
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix
to Part Number
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
ESD Ratings: Human Body Model = 3B
Machine Model = C
Marking: SS26
Rating
Symbol
V
RRM
V
RWM
V
R
I
O
I
FSM
Value
60
Unit
V
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES
60 VOLTS
Mechanical Characteristics:
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
SS26
SS26 = Device Code
MAXIMUM RATINGS
ORDERING INFORMATION
Device
SS26T3
2.0
40
A
A
SS26T3G
Package
SMB
SMB
(Pb−Free)
Shipping
†
2500 / Tape & Reel
2500 / Tape & Reel
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated V
R
, T
L
= 95°C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Condi-
tions Halfwave, Single Phase, 60 Hz)
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated V
R
, T
J
= 25°C)
T
stg
, T
C
T
J
dv/dt
−55
to +150
−55
to +150
10,000
°C
°C
V/ms
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Semiconductor Components Industries, LLC, 2005
February, 2005
−
Rev. 2
1
Publication Order Number:
SS26/D
ONSEMI [ ON SEMICONDUCTOR ]
