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SOP‐8/EP Dimension
NOTES:
A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.006 (0.15) per end.
D. Body width dimension does not include inter‐lead flash or protrusions. Inter‐lead flash and protrusions shall not exceed
0.010 (0.25) per side.
E. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the cross‐hatched
area.
F. Lead dimension is the length of terminal for soldering to a substrate.
G. The lead width, as measured 0.014 (0.36) or greater above the seating plane, shall not exceed a maximum value of 0.024
(0.61).
H. Lead to lead coplanarity shall be less than 0.004 (0.10) form Seating Plane.
I. Falls within JEDEC MS‐012 variation AA.
DS‐RS6501‐06
September, 2010
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