Page No. : 7/8
Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10
o
C~35
o
C Humidity=65%±15%
2. Reflow soldering of surface‐mount devices
Figure 1: Temperature profile
t
P
T
P
Ramp-up
T
L
Ts
max
Temperature
t
L
Critical Zone
T
L
to T
P
Ts
min
t
S
Preheat
Ramp-down
25
t 25
o
C to Peak
Time
Profile Feature
Average ramp‐up rate (T
L
to T
P
)
Preheat
‐ Temperature Min (Ts
min
)
‐ Temperature Max (Ts
max
)
‐ Time (min to max) (ts)
Tsmax to T
L
‐ Ramp‐up Rate
Time maintained above:
‐ Temperature (T
L
)
‐ Time (t
L
)
Peak Temperature (T
P
)
Time within 5
o
C of actual Peak
Temperature (t
P
)
Ramp‐down Rate
Time 25
o
C to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb‐Free devices.
DS‐RS6501‐06
September, 2010
www.Orister.com
o
Sn‐Pb Eutectic Assembly
<3
o
C/sec
100
o
C
150
o
C
60~120 sec
<3 C/sec
183 C
60~150 sec
240
o
C +0/‐5
o
C
10~30 sec
<6
o
C/sec
<6 minutes
o
Pb‐Free Assembly
<3
o
C/sec
150
o
C
200
o
C
60~180 sec
<3 C/sec
217
o
C
60~150 sec
260
o
C +0/‐5
o
C
20~40 sec
<6
o
C/sec
<8 minutes
o
Peak temperature
245
o
C ±5
o
C
260
o
C +0/‐5
o
C
Dipping time
5sec ±1sec
5sec ±1sec
ORISTER [ ORISTER CORPORATION ]
