SFH 4056
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
300
˚C
Vorbehandlung nach JEDEC Level 3
Preconditioning acc. to JEDEC Level 3
(nach J-STD-020-D.01)
(acc. to J-STD-020-D.01)
OHA04525
T
250
240 ˚C
217 ˚C
T
p
245 ˚C
t
P
t
L
t
S
200
150
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Pb-Free (SnAgCu) Assembly
Profile Feature
Ramp-up Rate to Preheat*
)
25°C to 150°C
Time t
s
from T
Smin
to T
Smax
(150°C to 200°C
Ramp-up Rate to Peak*
)
T
Smax
to T
P
Liquidus Temperture T
L
Time t
L
above T
L
Peak Temperature T
P
Time t
P
within 5°C of the specified peak
temperature T
P
- 5K
Ramp-down Rate*
T
P
to 100°C
Time 25°C to Peak temperature
Recommendation
2°C / sec
100s
2°C / sec
Max. Ratings
3°C / sec
min. 60sec max. 120sec
3°C / sec
217°C
80sec
245°C
20sec
3°C / sec
max. 100sec
max. 260°C
min. 10sec max. 30sec
6°C / sec maximum
max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation
ΔT/Δt: Δt
max. 5 sec; fulfillment for the whole T-range
2010-11-09
8
OSRAM [ OSRAM GMBH ]
