SFH 303, SFH 303 FA
Maßzeichnung
Package Outlines
9.0 (0.354)
8.2 (0.323)
7.8 (0.307)
7.5 (0.295)
Area not flat
25.2 (0.992)
24.2 (0.953)
0.7 (0.028)
0.4 (0.016)
1.8 (0.071)
1.2 (0.047)
0.6 (0.024)
0.4 (0.016)
2.54 (0.100) 2.54 (0.100)
spacing spacing
5.9 (0.232)
5.5 (0.217)
5.1 (0.201)
4.8 (0.189)
6.9 (0.272)
11.5 (0.453)
10.9 (0.429)
B C E
0.6 (0.024)
0.4 (0.016)
GEOY6351
Chip position
Maße in mm (inch) / Dimensions in mm (inch).
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
T
250
235 C ... 260 C
10 s
Normalkurve
standard curve
2. Welle
2. wave
Grenzkurven
limit curves
200
1. Welle
1. wave
150
100 C ... 130 C
100
2 K/s
50
Zwangskühlung
forced cooling
ca 200 K/s
5 K/s
2 K/s
0
0
50
100
150
t
200
s
250
2007-04-02
6
OSRAM [ OSRAM GMBH ]
