B1S thru B10S
MINI SURFACE MOUNT GLASS PASSIVATED RECTIFIERS
VOLTAGE - 100 TO 1000 VOLTS
CURRENT - 0.5 AMPERES
FEATURES
Plastic material used carries Underwiters
Laboratory recognition 94V-0
Low leakage
Surge overload rating-30 amperes peak
Ldeal for printed circuit board
Exceeds environmental standards of MMIL-S-19500
MECHANICAL DATA
Case Reliable low cost construction utilizing molded
plastic technique results in inexpensive product
Terminals Lead solderable per MIL-STD-202, Method 208
Polarity Polarity symbols molded or marking on body.
Mounting position Any
Weight 0.008 ounce, 0.22gram
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temp. unless otherwise specified
Single phase, half sine wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%
B1S
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward on glass-epoxy P
.C.B (Note 1)
0
Current T
A
=30 C on aluminum substrate (Note 3)
Peak Forward Surge Current, 8.3ms Single Half Sine-Wave
Superimposed on Rated Load
I
2
t Rating fusing (t<8.35ms)
Maximum Forward Voltage Drop per Bridge Element at 0.5A
Maximum Reverse Current at Rated T
J
=25 C
0
DC Blocking Voltage per element T
J
=125 C
Typical Junction capacitance per leg (Note 1) C
J
Typical Thermal resistance per leg (Note 2) R
Operating Temperature Range T
J
Storage Temperature Range T
A
JA
0
B2S
200
140
200
B4S
400
280
400
0.5
0.8
30
5
1
5
25
85
B6S
600
420
600
B8S
800
560
800
B10S
1000
700
1000
UNITS
Volts
Volts
Volts
Amps
100
70
100
Amps
A
2
t
V
A
pF
0
C/W
0
-55 to +150
-55 to +150
C
C
0
NOTES
1. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0 Volts
2. Thermal Resestance From Junction to Ambient and from junction to lead mounted on P
.C.B with 0.05 x 0.05 (13x13mm) copper pads.
3. On alum substrate P
.C.B with an rea of 0.8x0.8x0.25 (20x20x6.4mm) mounte on 0.05x0.05 (13x13mm) solder pad.
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