MMSZ5221B THRU MMSZ5262B
SURFACE MOUNT ZENER TYPE
SOD-123F
0.071(1.80)
0.055(1.40)
0.110(2.80)
0.098(2.50)
0.028(0.70)
0.019(0.50)
0.154(3.90)
0.141(3.60)
Dimensions in inches and (millimeters)
FEATURES
•
Up to 500mW power dissipation.
•
Silicon epitaxial planar chip structure.
•
Wide zener reverse voltage range 2.4V to 75V.
•
Very tiny package size for high density applications.
•
Ideally suited for automated assembly processes.
•
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
MECHANICAL DATA
•
Epoxy:UL94-VO rated flame retardant
•
Case : Molded plastic, SOD-123F
•
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 0.010 gram
MAXIMUM RATINGS
(at T
A
=25 C unless otherwise noted)
o
PARAMETER
Forward voltage
Power Dissipation
Forward surge current
Storage temperature
Operating temperature
I
F
= 100 mA DC
CONDITIONS
Symbol
V
F
P
D
0.008(0.20)MAX
0.053(1.35)
0.037(0.95)
MIN.
TYP.
MAX.
1.00
500
4000
UNIT
V
mW
mA
o
8.3ms single half sine-wave superimposed
on rate load (JEDEC methode)
I
FSM
T
STG
T
J
-65
-55
+175
+150
C
C
o
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