AXT3, 4
Header
(Mated height: 2.0mm, 3.0mm)
Recommended PC board pattern (TOP VIEW)
Max. 0.90
(0.75)
1.45±0.03
2.95±0.03
Please refer to the latest product
specifications when designing your
product.
0.80±0.03
0.45±0.03
0.65±0.03
(1.15)
0.23±0.03
0.40±0.03
: Insulation area
Recommended metal mask pattern
Metal mask thickness: When 150
µm
(Terminal portion opening area ratio: 49%)
(Metal portion opening area ratio: 100%)
(0.42)
1.91±0.01
2.75±0.01
(0.52)
1.71±0.01
2.75±0.01
0.80±0.01
0.45±0.01
2.95±0.01
0.65±0.01
(1.15)
0.20±0.01
0.40±0.01
Recommended metal mask pattern
Metal mask thickness: When 120
µm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
0.80±0.01
0.45±0.01
2.95±0.01
0.65±0.01
(1.15)
0.20±0.01
0.40±0.01
Note: The recommended PC board pattern
diagrams and metal mask pattern diagrams
for headers with mated heights of 1.5 mm/
2.5 mm and 2.0 mm/3.0 mm are different.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB14E 201303-T
PANASONIC [ PANASONIC SEMICONDUCTOR ]
