CUSTOMER DRAWING
3mm
±1mm
Product Dimensions
As Received
After Free Recovery
A±2.54
(A±0.100)
25.40
(1.000)
27.90
(1.100)
33.02
(1.300)
øB
min
4.32
(0.170)
6.35
(0.250)
9.14
(0.360)
W
min
0.30
(0.012)
0.38
(0.015)
0.38
(0.015)
øB
max
2.03
(0.080)
3.05
(0.120)
4.57
(0.180)
W
min
0.76
(0.030)
1.02
(0.040)
1.27
(0.050)
Product
Name
D-300-08
D-300-12
D-300-18
Maximum
Weight
Pounds/mpc
1.15
2.55
4.50
MATERIALS
1. MOLDED CAP: Heat-shrinkable, cross-linked modified polyolefin.
2. MELTABLE RING: Modified thermoplastic.
3. DEFORMABLE DAM: Radiation cross-linked, thermally stabilized modified polyolefin.
APPLICATION
1. These parts are designed to meet the requirements as shown in the Requirements Section when tested as listed.
2. Parts to be assembled as outlined herein.
3. “B” recovered is the maximum inside diameter of the heat-shrinkable cap.
4. “W” is the wall thickness of the molded cap only, and is measured along the vertical wall.
5. “A” is the average length of the cap and is equal to (A min + A max)/2.
1.0
SCOPE
This document covers the requirements and test procedures applicable to heat shrinkable, stub-splice
encapsulation cap (caps) and the molded component thereof.
2.0
APPLICABLE DOCUMENTS
The specifications and standards referenced herein shall form part of this specification to the extent
specified.
Tyco Electronics
305 Constitution Dr
Menlo Park, CA
94025, U.S.A.
TITLE:
CAP, SPLICE ENCAPSULATION
DOCUMENT NO.:
Unless otherwise specified dimensions are in millimeters.
[Inches dimensions are shown in brackets]
TOLERANCES:
0.00 N/A
0.0 N/A
0 N/A
DRAWN BY:
ANGLES: N/A
ROUGHNESS
IN MICRON
CAGE CODE:
Raychem
Devices
D-300-08/-12/-18
REV:
DATE:
Tyco Electronics reserves the right to
amend this drawing at any time. Users
should evaluate the suitability of the
product for their application.
ECO NUMBER:
REPLACES:
B
SCALE:
SIZE:
31-July-08
SHEET:
M. FORONDA
06090
D010044
08-018889
NTS
A
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© 2008 Tyco Electronics Corporation. All rights reserved
If this document is printed it becomes uncontrolled. Check for the latest revision.
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