MBR3020PT~MBR30200PT
30 AMPERES SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Metal silicon junction, majority carrier conduction
• Low power loss, high efficiency.
• High current capability
• Guardring for overvlotage protection
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• Component are in compliance with EU RoHS 2002/95/EC directives
.126(3.2)
.110(2.8)
.050(1.25)
.045(1.15)
.142(3.6)
.125(3.2)
20 to 200 Volts
CURRENT
30 Amperes
TO-3P
Unit: inch (mm)
.640(16.25)
.620(15.75)
.199(5.05)
.175(4.45)
.087(2.2)
.070(1.8)
.600(15.25)
.580(14.75)
.839(21.3)
.819(20.8)
.095(2.4)
.798(20.25)
.777(19.75)
.170(4.3)
.145(3.7)
.030(0.75)
.017(0.45)
.225(5.7)
.204(5.2)
.225(5.7)
.204(5.2)
MECHANICALDATA
Case: TO-3P molded plastic
Terminals: solder plated, solderable per MIL-STD-750, Method 2026
Polarity: As marked.
Mounting Position: Any
Weight: 0.2 ounces, 5.6 grams.
AC
Positive CT
AC
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
P A R A M E TE R
M a xim um R e curre nt P e a k R e ve rse V o lta g e
M a xim um R M S V o lta g e
M a xim um D C B lo cking V o lta g e
M a xim um A ve ra g e F o rw a rd C urre nt (S e e fig .1 )
P e a k F o rw a rd S urg e C urre nt :8 .3 m s sing le ha lf sine -
w a ve sup e rim p o se d o n ra te d lo a d (JE D E C m e tho d )
M a xim um F o rw a rd V o lta g e a t 1 5 A , p e r le g
M a xim um D C R e ve rse C urre nt
Tc
= 2 5
O
C
a t R a te d D C B lo cking V o lta g e T
c
= 1 2 5
O
C
Typ ica l T he rm a l R e sista nce
O p e ra ting Junctio n Te m p e ra ture R a ng e
S to ra g e Te m p e ra ture R a ng e
S YM B O L
V
RRM
V
RM S
V
DC
I
AV
I
FS M
V
F
M BR
M BR
M BR
M BR
3020P T 3030P T 3040P T 3045P T
20
14
20
30
21
30
40
28
40
45
3 1 .5
45
M BR
M BR
M BR
M BR
M BR
M BR
U N IT S
3050P T 3060P T 3080P T 30100P T 30150P T 30200P T
50
35
50
30
200
60
42
60
80
56
80
100
70
100
150
105
150
200
140
200
V
V
V
A
A
0 .8
0. 2
9
V
0 .6 5
0 .7 5
0 .1
20
1 .4
-5 0 T O + 1 5 0
-5 0 T O + 1 7 5
I
R
R
θ
JC
T
J
T
S TG
mA
O
C /W
O
C
C
O
Notes :
Both Bonding and Chip structure are available.
STAD-DEC.22.2006
PAGE . 1
PANJIT [ PAN JIT INTERNATIONAL INC. ]
