MBR3040CT SERIES
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
0.624(15.87)
0.548(13.93)
40 to 200 Volts
CURRENT
30 Amperes
0.419(10.66)
0.387(9.85)
0.139(3.55)
MIN.
0.196(5.00)
0.163(4.16)
0.054(1.39)
0.045(1.15)
• Metal silicon junction, majority carrier conduction
• Low power loss, high efficiency.
• High current capability
• Guardring for overvoltage protection
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
0.177(4.5)
MAX.
0.058(1.47)
0.042(1.07)
0.038(0.96)
0.019(0.50)
0.50(12.7)MIN.
0.115(2.92)
0.080(2.03)
0.025(0.65)MAX.
MECHANICAL DATA
• Case: TO-220AB molded plastic
• Terminals: solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Mounting Position: Any
• Weight: 0.0655 ounces, 1.859 grams.
0.100(2.54)
0.100(2.54)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA ME TE R
Ma xi mum Re curre nt P e ak Re ve rse Voltag e
Ma xi mum RMS Vo lta g e
Ma xi mum D C B lo cki ng Vo lta ge
Ma xi mum A vera g e F o rwa rd C urre nt
P e ak Fo rward S urg e C urre nt
：
8.3 ms si ng le
ha lf si ne-wa ve sup e ri mp o se d o n ra te d lo a d
(JE D E C metho d )
Ma xi mum F o rwa rd Vo lta ge at 1 5A p e r leg
Ma xi mum D C Re ve rse C urrent
at Ra te d D C B lo cki ng Voltag e
Typ i cal Therma l Resi sta nce
Op erati ng Juncti o n a nd S to ra ge Te mp e ra ture
Ra ng e
T
J
=25
O
C
T
J
=12 5
O
C
S YMB OL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FS M
V
F
I
R
R
JC
T
J
,T
STG
MB R30 40 CT MB R3 04 5C T MB R30 50 CT MB R30 60 CT MBR3 08 0C T MB R3 09 0C T MB R3 01 00 C T MBR3 01 50C T MB R30 20 0C T
UNITS
V
V
V
A
40
28
40
45
31 .5
45
50
35
50
60
42
60
80
56
80
30
90
63
90
1 00
70
1 00
15 0
10 5
15 0
2 00
140
2 00
275
A
0 .7
0 .7 5
0.1
20
1 .4
0 .8
0.9
V
mA
O
C /W
O
-5 5 to + 1 50
-6 5 to + 1 75
C
Note :
Both Bonding and Chip structure are available.
August 30,2010-REV.03
PAGE . 1
PANJIT [ PAN JIT INTERNATIONAL INC. ]
