MBR6040PT SERIES
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Metal silicon junction, majority carrier conduction
• Low power loss, high efficiency.
• High current capability
• Guardring for overvoltage protection
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
0.087(2.20)
0.070(1.80)
0.126(3.20)
0.110(2.80)
0.050(1.25)
0.045(1.15)
0.142(3.60)
0.125(3.20)
0.640(16.25)
0.620(15.75)
0.199(5.05)
0.175(4.45)
40 to 200 Volts
CURRENT
60 Amperes
0.600(15.25)
0.580(14.75)
0.839(21.30)
0.819(20.80)
0.095(2.40)
0.170(4.30)
0.145(3.70)
0.798(20.25)
0.777(19.75)
MECHANICAL DATA
• Case: TO-247AD / TO-3P molded plastic
• Terminals: solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Mounting Position: Any
• Weight: 0.2245 ounces, 6.3673 grams.
0.030(0.75)
0.017(0.45)
0.225(5.70)
0.204(5.20)
0.225(5.70)
0.204(5.20)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RAMETE R
Maxi mum Recurrent P eak Reverse Voltage
Maxi mum RMS Voltage
Maxi mum D C B locki ng Voltage
Maxi mum A verage F orward C urrent
Peak F orward Surge C urrent : 8.3ms si ngle
half si ne-wave superi mposed on rated load
(JE DE C method)
Maxi mum F orward Voltage at 30A per leg
Maxi mum D C Reverse Current at
Rated D C B locki ng Voltage
Typi cal Thermal Resi stance
Operati ng Juncti on and S torage Temperature
Range
T
J
=25
O
C
T
J
=100
O
C
S YMB OL
V
RRM
V
RMS
V
DC
I
F(AV )
I
FS M
V
F
I
R
R
JC
T
J
,T
S TG
-55 to + 150
MB R6040P T MB R6045P T MB R6050P T MB R6060P T MB R6080P T MB R6090P T MB R60100P T MB R60150P T MBR60200P T
UNITS
V
V
V
A
40
28
40
45
31.5
45
50
35
50
60
42
60
80
56
80
60
90
63
90
100
70
100
150
105
150
200
140
140
400
A
0.7
0.1
20
0.79
0.8
0.05
20
1.5
-65 to +175
0.9
V
mA
O
C /W
O
C
Note :
Both Bonding and Chip structure are available.
September 3,2010-REV.02
PAGE . 1
PANJIT [ PAN JIT INTERNATIONAL INC. ]
