L-32ROPT1C 参数 Datasheet PDF下载

型号：	L-32ROPT1C
PDF下载：	下载PDF文件查看货源
内容描述：	[Photo Transistor, 940nm, LEAD FREE, PLASTIC PACKAGE-2]
分类和应用：	光电
文件页数/大小：	14 页 / 390 K
品牌：	PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]

3.0 mm

FORMED LEAD

PHOTOTRANSISTOR

L-32ROPT1C

REV:A / 2

1) The lead should be bent at a point located at least 2mm away from the package. Bending

should be performed with base fixed means of a jig or pliers (Fig.7)

F i g . 7

2) Forming lead should be carried our prior to soldering and never during or after soldering.

3) Form the lead to ensure alignment between the leads and the hole on board, so that stress

against the LED is prevented. (Fig.8)

LEAD STRENGTH

1) Bend strength

Do not bend the lead more than twice. (Fig.9)

Fig.9

DRAWING NO. : DS-21-03-0009

2 m m

DATE : 2005-12-19

Page :9

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