3.0 mm
SOLDERING
METHOD
DIA LED
LAMP
REV:A / 0
L-3541GD-AH
SOLDERING CONDITIONS
REMARK
Solder no closer than 3mm from the
DIP
SOLDERING
Bath temperature: 240℃
Immersion time: with 3 sec, 1 time
base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 300
℃
or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
L e a d w r i e s
P a n e l
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
L e a d w r i e s
L e a v e
a s l i g h t
c l e a r a n c e
(Fig.2)
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and sliver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3
seconds.
DRAWING NO. : DS-33-09-0053
DATE : 2009-03-18
Page : 6
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
