Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-C191QYCT
REV:A / 2
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60
solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
、
℃
1 Pre-Heat Temp:150-180 ,120sec.Max.
、
℃
2 Soldering Temp:Temperature Of Soldering Pot Over 230 ,40sec.Max.
、
℃，
3 Peak Temperature:260
5sec.
、
4 Reflow Repetition:2 Times Max.
、
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
、
℃
1 Iron Tip Temp:350 Max.
、
2 Soldering Iron:30w Max.
、
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
、
℃
1 Pre-Heat Temp:150 Max. 120 Sec. Max.
、
℃
2 Bath Temp:265 Max.
3、Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-74-07-0012
DATE : 2009-11-24
PAGE
12 of 14
PARA-FOR-068
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
