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PARALIGHT DCC
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-S115KRKGCT-5A
REV: A / 0
3.Soldering(Standard Process) :
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60s Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp : 150-180℃,120sec.Max.
2、Soldering Temp : Temperature Of Soldering Pot Over 230℃,40sec.Max.
3、Peak Temperature : 260℃，5sec.
4、Reflow Repetition : 2 Times Max.
5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp : 350℃ Max.
2、Soldering Iron : 30w Max.
3、Soldering Time : 3 Sec. Max. One Time.
For Dip Soldering :
1、Pre-Heat Temp : 150℃ Max. 120 Sec. Max.
2、Bath Temp : 265℃ Max.
3、Dip Time : 5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-78-08-0001
DATE : 2008-01-14 PAGE
13 of 15
PARA-FOR-068
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
