5.0 mm DIA LED LAMP
L513HD-U1
REV:A / 0
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK！
1Kg
Fig.10
y HEAT MANAGEMANT
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when designing the system. The temperature increase is affected by
the thermal resistance of the circuit board and density of LED placement on the board, as
well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
2) The operating current (IF) should be decided after considering the ambient maximum
temperature of LEDs.
DRAWING NO. : DS-35-09-0166
DATE : 2009-08-20
Page :10
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
