10 Base-T Interface Module
ELECTRONICS INC.
EPE6199S
• Optimized for Level One LXT905 •
• Two pairs of TX and RX in 40 pin SOIC package •
• Robust design allows for toughest soldering process •
• Complies with or exceeds IEEE 802.3, 10 Base-T Requirements •
Electrical Parameters @ 25° C
Group
Delay
(nS Max.)
5-10
MHz
Xmit
3
Rcv
---
•
Xmit
-1
Insertion
Loss
(dB Max.)
1-10
MHz
Rcv
-1
Xmit
-15
Return
Loss
(dB Min.)
5-10
MHz
Rcv
-15
@ 25
MHz
Xmit
-10
Rcv
---
Attenuation
(dB Min.) (1)
Common Mode
Rejection
(dB Min.)
@ 40
MHz
Xmit
-30
Rcv
---
@ 50
MHz
Xmit
-30
Rcv
-30
@ 100
MHz
Xmit
-25
Rcv
-25
-30
Crosstalk
(dB Min.)
@ 30
MHz
Xmit
-20
Rcv
---
@ 1-10
MHz
Isolation
: meets or exceeds 802.3 IEEE Requirements •
Characteristic Filter Impedance
: 100
Ω
•
(1) Referenced @ 5 MHz response.
Schematic
Transmit Channel
1,11
2,12
1:2
12.4Ω
LPF
3,13
12.4Ω
38,27
40,29
39,28
8,18
100Ω
9,19
10,20
33,22
1:1
34,23
Receive Channel
Package
A
(J)
R
N
Dim.
PCA
EPF6199S
Date Code
B
40
21
Solder Pad Layout
Q
1
20
P
A
B
C
D
E
F
G
H
I
(J)
K
L
M
N
P
Q
R
S
Dimensions
(Inches)
Min.
Max. Nom.
1.105
.470
.200
.950
.005
.050
.620
.016
.008
.083
0°
.025
1.125
.490
.220
Typ.
.015
Typ.
.640
.022.
.012
Typ.
8°
.045
.030
.050
.090
.670
2 plcs
2 plcs
(Millimeters)
Min.
Max. Nom.
28.67
11.94
5.08
24.13
.127
1.27
15.75
.406
.203
2.10
0°
.635
28.58
12.45
5.59
Typ.
.381
Typ.
16.26
.559
.305
Typ.
8°
1.14
.762
1.27
2.29
17.02
2 plcs
2 plcs
S
D
C
F
H
E
M
K
L
G
I
.200
.250
Typ.
Typ.
5.08
6.35
Typ.
Typ.
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
CSE6199Sa
Rev.-
6/5/97
Product performance is limited to specified parameters. Data is subject to change without prior notice.
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com