ELECTRONICS INC.
10/100 Base-X Module for
Level One LXT 974
Multi-Port Applications
EPF8082S
• Robust design allows for toughest soldering processes •
• Guaranteed to operate with 8 mA DC bias at 70°C •
• Complies with or exceeds IEEE 802.3, 10 BT/100 BX Standards •
Electrical Parameters @ 25° C
OCL
@ 70°C
100 KHz, 0.1 Vrms
8 mA DC Bias
Media Side
350µH
0.1-80
MHz
Xmit
-1
Rcv
-1
•
Xmit
-1
Insertion Loss
(dB Max.)
100
MHz
Rcv
-1
Xmit
-3
150
MHz
Rcv
-3
Xmit
-18
1-30
MHz
Rcv
-18
Xmit
-12
Return Loss
(dB Min.)
60
MHz
Rcv
-12
Xmit
-10
100
MHz
Rcv
-10
-35
Crosstalk
(dB Min.)
0.1-100
MHz
Isolation
: 1500 Vrms •
Impedance
: 100
Ω
•
Rise Time
: 3.0 nS Max.
Schematic
Receive Channel
1, 6, 11, 16
1:1
40, 35, 30, 25
3, 8, 13, 18
4, 9, 14, 19
2, 7, 12, 17
39, 34, 29, 24
5, 10, 15, 20
Transmit Channel
2 :1
38, 33, 28, 23
37, 32, 27, 22
36, 31, 26, 21
Chip
Side
Media
Side
Chip
Side
Media
Side
Package
A
J
N
Dim.
A
B
C
D
E
F
G
H
I
J
K
L
M
N
P
Q
Dimensions
(Inches)
Max. Nom.
Min.
1.110
.470
.235
.950
.008
.050
.580
.016
.008
.085
0°
.025
1.130
.490
.255
Typ.
.012
Typ.
.600
.022
.012
Typ.
8°
.045
.030
.050
.090
.670
(Millimeters)
Min.
Max. Nom.
28.19
11.94
5.97
24.13
.203
1.27
14.73
.406
.203
2.16
0°
.635
28.70
12.45
6.48
Typ.
.305
Typ.
15.24
.559
.305
Typ.
8°
1.14
.762
1.27
2.29
17.02
PCA
EPF8082S
Date Code
B
40
21
Solder Pad Layout
Q
1
20
P
D
M
I
C
F
H
E
K
L
G
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
CSF8082S Rev. -
10/9/97
Product performance is limited to specified parameters. Data is subject to change without prior notice.
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com