PE64101
Product Specification
Figure 3. Pin Configuration (Top View)
Pin 1
12
11
10
Table 3. Operating Ranges
1
Parameter
V
DD
Supply Voltage
I
DD
Power Supply Current
(Normal mode)
6
Symbol
V
DD
I
DD
I
DD
V
IH
V
IL
1.2
0
Min
2.3
Typ
2.8
30
20
Max
3.6
75
45
3.1
0.2
6
6
6
+26
+20
I
CTL
T
OP
T
ST
-40
-65
1
10
+85
+150
Units
V
µA
µA
V
V
V
PK
V
PK
V
PK
dBm
dBm
µA
°C
°C
SEN
11
13
GND
8
9 RF+
I
DD
Power Supply Current
(Standby mode)
6
Control Voltage High
GND
22
33
8 GND
7
7 RF-
6
Control Voltage Low
Peak Operating RF Voltage
5
V
P
to V
M
V
P
to RFGND
V
M
to RFGND
RF Input Power (50Ω )
3, 4, 5
shunt
series
Input Control Current
SCLK
4
5
6
Table 2. Pin Descriptions
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
Pin Name
SEN
GND
SCLK
VDD
GND
RF-
RF-
GND
RF+
RF+
GND
SDAT
GND
Serial Enable
Digital and RF Ground
Serial Interface Clock Input
Power Voltage
Digital and RF Ground
Negative RF Port
1
Negative RF Port
1
Digital and RF Ground
3
Positive RF Port
2
Positive RF Port
2
Operating Temperature Range
Storage Temperature Range
Description
Notes: 1. Operation should be restricted to the limits in the Operating Ranges table
2. The DTC is active when STBY is low (set to 0) and in low-current
stand-by mode when high (set to 1)
3. Maximum CW power available from a 50Ω source in shunt configuration
4. Maximum CW power available from a 50Ω source in series configuration
5. RF+ to RF- and RF+ and/or RF- to ground. Cannot exceed 6 V
PK
or max
RF input power (whichever occurs first)
6. I
DD
current typical value is based on V
DD
= 2.8V. Max I
DD
is based on
V
DD
= 3.6V
Table 4. Absolute Maximum Ratings
Symbol
V
DD
V
I
V
ESD
V
ESD
Parameter/Conditions
Power supply voltage
Voltage on any DC input
ESD Voltage (HBM, MIL_STD
883 Method 3015.7)
ESD Voltage (MM, JEDEC
JESD22-A115-A)
Min
-0.3
-0.3
Max
4.0
4.0
2000
100
Units
V
V
V
V
Digital and RF Ground
Serial Interface Data Input
Digital and RF Ground
3
Notes: 1. Pins 6 and 7 must be tied together on PCB board to reduce
inductance
2. Pins 9 and 10 must be tied together on PCB board to reduce
inductance
3. Pin 2, 5, 8, 11 and 13 must be connected together on PCB
Exceeding absolute maximum ratings may cause
permanent damage. Operation between operating
range maximum and absolute maximum for
extended periods may reduce reliability.
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS
®
device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the
PE64101 in the 12-lead 2 x 2 QFN package is
MSL1.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS
®
devices are immune to latch-up.
Document No. 70-0378-01
│
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©2012 Peregrine Semiconductor Corp. All rights reserved.
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