Solder Reflow Profile:
Tp
Ramp-up
Critical Zone
T
L
to Tp
Ramp-down
High Temperature Infrared /Convection
Note:Temperature shown are applied to body of device
Ts max to T
L
(Ramp-up Rate)
Preheat
Temperature Min(Ts Min)
Temperature Typical( Ts Typ)
Temperature Max.(Ts Max)
Time(ts)
Ram-up Rate(T
L
to Tp)
Time Maintained Above:
--Temperature(T
L
)
--Time(T
L
)
Peak Temperature (Tp)
Target Peak Temperature(Tp Target)
Time within 5℃ of actual peak(t
p
)
Ramp-down Rate
Tune 25℃ to Peak Temperature(t)
Moisture Sensitivity Level
3°C/second max.
150°C
175°C
200°C
60-180 seconds
3°C/second Max
217°C
60-150 seconds
260°C max.
seconds
250°C+0/-5°C
20-40 seconds
6°C/seconds Max
8 minutes Max
Level 1
for
10
High Temperature Manual Soldering
Note:Temperature shown are applied to body of device
260°C
max.
for 5 seconds
max.,
2 times
max.
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Temperature(T)
T
L
Ts Max
Ts Min
Ts Preheat
t 25℃ to Peak
t
L
t
p
Time (t)
PETERMANN [ PETERMANN-TECHNIK ]
