Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 1:
Quick reference data
…continued
GND = 0 V; T
amb
= 25
°
C; t
r
= t
f
= 6 ns.
Symbol
C
I
C
I/O
C
PD
Parameter
input capacitance
input/output capacitance
power dissipation
capacitance per
transceiver
V
I
= GND to
V
CC
−
1.5 V
Conditions
Min
-
-
-
Typ
3.5
10
30
Max
-
-
-
Unit
pF
pF
pF
[1]
C
PD
is used to determine the dynamic power dissipation (P
D
in
µW):
P
D
= C
PD
×
V
CC2
×
f
i
×
N +
∑
(C
L
×
V
CC2
×
f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in V;
N = number of inputs switching;
∑
(C
L
×
V
CC2
×
f
o
) = sum of outputs.
4. Ordering information
Table 2:
Ordering information
Package
Temperature range Name
74HC245N
74HC245D
74HC245PW
74HC245DB
74HC245BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
DIP20
SO20
TSSOP20
SSOP20
Description
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads;
body width 7.5 mm
Version
SOT146-1
SOT163-1
Type number
plastic thin shrink small outline package; 20 leads; SOT360-1
body width 4.4 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
DHVQFN20 plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
DIP20
SO20
TSSOP20
SSOP20
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads;
body width 7.5 mm
SOT146-1
SOT163-1
74HCT245N
74HCT245D
74HCT245PW
74HCT245DB
74HCT245BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
plastic thin shrink small outline package; 20 leads; SOT360-1
body width 4.4 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
DHVQFN20 plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
9397 750 14502
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 January 2005
2 of 22
PHILIPS [ NXP SEMICONDUCTORS ]
